Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module

ABSTRACT

Systems that include integrated circuit dies and voltage regulator units are disclosed. Such systems may include a voltage regulator module and an integrated circuit mounted in a common system package. The voltage regulator module may include a voltage regulator circuit and one or more passive devices mounted to a common substrate, and the integrated circuit may include a System-on-a-chip. The system package may include an interconnect region that includes wires fabricated on multiple conductive layers within the interconnect region. At least one power supply terminal of the integrated circuit may be coupled to an output of the voltage regulator module via a wire included in the interconnect region.

PRIORITY CLAIM

The present application is a continuation of U.S. application Ser. No.17/080,609, entitled “Structure and Method for Fabricating a ComputingSystem with an Integrated Voltage Regulator Module,” filed Oct. 26,2020, which is a continuation of U.S. application Ser. No. 15/943,673,entitled “Structure and Method for Fabricating a Computing System withan Integrated Voltage Regulator Module,” filed Apr. 2, 2018 (now U.S.Pat. No. 10,818,632), which is a continuation of U.S. application Ser.No. 15/264,087, entitled “Structure and Method for Fabricating aComputing System with an Integrated Voltage Regulator Module,” filedSep. 13, 2016 (now U.S. Pat. No. 9,935,076), which claims priority toU.S. Provisional Appl. No. 62/234,776, entitled “Structure and Methodfor Fabricating a Computing System with an Integrated Voltage RegulatorModule,” filed Sep. 30, 2015; the disclosures of each of theabove-referenced applications are incorporated by reference herein intheir entireties.

BACKGROUND Technical Field

Embodiments described herein relate to integrated circuit packages, andmore particularly, to techniques for packaging voltage regulators.

Description of the Related Art

A variety of electronic devices are now in daily use with consumers.Particularly, mobile devices have become ubiquitous. Mobile devices mayinclude cell phones, personal digital assistants (PDAs), smart phonesthat combine phone functionality and other computing functionality suchas various PDA functionality and/or general application support,tablets, laptops, net tops, smart watches, wearable electronics, etc.

Such mobile devices may include multiple integrated circuits, eachperforming different tasks. In some cases, circuits that performdifferent tasks may be integrated into a single integrated forming asystem on a chip (SoC). The different functional units within a SoC mayoperate at different power supply voltage levels. In some designs, powersupply or regulator circuits may be included in the SoC to generatedifferent voltage levels for the myriad functional units included in theSoC.

Voltage regulators may employ one or more passive components, such as,e.g., inductors and capacitors in order to improve performance. Thefabrication of such passive components may employ different processingsteps and materials than those used in manufacturing an SoC. In suchcases, the passive components may be manufactured separately from theSoC.

SUMMARY OF THE EMBODIMENTS

Various embodiments of a system package are disclosed. Broadly speaking,a system is contemplated in which a module includes one or more passivecircuit elements, an interconnect region, and a voltage regulatorcontroller die configured to generate a regulated power supply using theone or more passive circuit elements. The interconnect region mayinclude a plurality of conductive paths, and each conductive path mayinclude a plurality of wires fabricated on a plurality of conductivelayers. The voltage regulator controller die may include a plurality ofterminals, and a first subset of the plurality of terminals may becoupled to respective terminals of a give passive circuit element via afirst subset of the plurality of conductive paths. Each terminal of asecond subset of the plurality of terminals may be coupled to respectivesolder balls of a plurality of solder balls via a given path of a secondsubset of the plurality of conductive paths.

In one embodiment, each of the one or more passive circuit elementsincludes at least one inductor and one capacitor.

In a further embodiment, the at least one inductor is included in afirst integrated circuit die, and the at least one capacitor is includedin a second integrated circuit die.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description makes reference to the accompanyingdrawings, which are now briefly described.

FIG. 1 illustrates an embodiment of an integrated circuit.

FIG. 2 illustrates an embodiment of a computing system employing avoltage regulator.

FIG. 3 illustrates a block diagram depicting an embodiment of a voltageregulator.

FIG. 4 illustrates an embodiment of a voltage regulator module.

FIG. 5 illustrates an embodiment of a voltage regulator module.

FIG. 6 illustrates an embodiment of a voltage regulator module.

FIG. 7 illustrates an embodiment of a voltage regulator module.

FIG. 8 illustrates an embodiment of a system package.

FIG. 9 illustrated an embodiment of a system package.

FIG. 10 illustrates an embodiment of a system package.

FIG. 11 illustrates an embodiment of a system package.

FIG. 12A illustrates an embodiment of a system package.

FIG. 12B illustrates a top view of the embodiment depicted in FIG. 12A.

FIG. 13 illustrates an embodiment of a system package.

FIG. 14 illustrates an embodiment of a system package.

FIG. 15 illustrates a flow diagram depicting an embodiment of a methodfor assembling a system package.

FIG. 16 illustrates a flow diagram depicting another embodiment of amethod for assembling a system package.

While the disclosure is susceptible to various modifications andalternative forms, specific embodiments thereof are shown by way ofexample in the drawings and will herein be described in detail. Itshould be understood, however, that the drawings and detaileddescription thereto are not intended to limit the disclosure to theparticular form illustrated, but on the contrary, the intention is tocover all modifications, equivalents and alternatives falling within thespirit and scope of the present disclosure as defined by the appendedclaims. The headings used herein are for organizational purposes onlyand are not meant to be used to limit the scope of the description. Asused throughout this application, the word “may” is used in a permissivesense (i.e., meaning having the potential to), rather than the mandatorysense (i.e., meaning must). Similarly, the words “include,” “including,”and “includes” mean including, but not limited to.

Various units, circuits, or other components may be described as“configured to” perform a task or tasks. In such contexts, “configuredto” is a broad recitation of structure generally meaning “havingcircuitry that” performs the task or tasks during operation. As such,the unit/circuit/component can be configured to perform the task evenwhen the unit/circuit/component is not currently on. In general, thecircuitry that forms the structure corresponding to “configured to” mayinclude hardware circuits. Similarly, various units/circuits/componentsmay be described as performing a task or tasks, for convenience in thedescription. Such descriptions should be interpreted as including thephrase “configured to.” Reciting a unit/circuit/component that isconfigured to perform one or more tasks is expressly intended not toinvoke 35 U.S.C. § 112, paragraph (f) interpretation for thatunit/circuit/component. More generally, the recitation of any element isexpressly intended not to invoke 35 U.S.C. § 112, paragraph (f)interpretation for that element unless the language “means for” or “stepfor” is specifically recited.

DETAILED DESCRIPTION OF EMBODIMENTS

In a computing system, it may be desirable to operate differentfunctional units of a System-on-a-chip (SoC) at different power supplyvoltage. In some cases, the computing system that includes such an SoCmay only receive a particular power supply voltage from a battery orother suitable DC power supply. In order to generate the desired powersupply voltage levels, a voltage regulator circuit may be employed.

Voltage regulator circuit may be designed according to one of variousdesign styles. In some cases, passive components, such as, e.g.,inductors and capacitors, are employed to improve the efficiency ofvoltage regulator circuits.

A manufacturing process used to fabricate voltage regulator circuits orSoCs may not be well suited for fabricating inductors and capacitors. Assuch, in some cases, inductors and capacitors to be used with voltageregulator circuits may be fabricated separately from the voltageregulator circuits and SoCs, and the mounted on a common circuit boardor other suitable medium.

In small form factor applications, such as, e.g., mobile computingdevices, reduced footprint assemblies of the voltage regulator circuit,SoC, and passive devices may be desirable. The embodiments illustratedin the drawings and described below may provide techniques assemblingvoltage regulator circuits, their related passive circuit elements, andother integrated circuits in a common system package while minimizingthe package footprint.

A block diagram of an integrated circuit including multiple functionalunits is illustrated in FIG. 1 . In the illustrated embodiment, theintegrated circuit 100 includes a processor 101, and a processor complex(or simply a “complex”) 107 coupled to memory block 102, andanalog/mixed-signal block 103, and I/O block 104 through internal bus105. In various embodiments, integrated circuit 100 may be configuredfor use in a desktop computer, server, or in a mobile computingapplication such as, e.g., a tablet or laptop computer.

As described below in more detail, processor 101 may, in variousembodiments, be representative of a general-purpose processor thatperforms computational operations. For example, processor 101 may be acentral processing unit (CPU) such as a microprocessor, amicrocontroller, an application-specific integrated circuit (ASIC), or afield-programmable gate array (FPGA). In some embodiments, processor 101may include one or more energy modeling units 106 which may beconfigured to estimate both dynamic and leakage power consumption on acycle and execution thread basis. In other embodiments, any functionalunit, such as, e.g., I/O block 104, may include an energy modeling unit.

Complex 107 includes processor cores 108A and 108B. Each of processorcores 108A and 108B may be representative of a general-purpose processorconfigured to execute software instructions in order to perform one ormore computational operations. Processor cores 108A and 108B may bedesigned in accordance with one of various design styles. For example,processor cores 108A and 108B may be implemented as an ASIC, FPGA, orany other suitable processor design. Each of processor cores 108A and108B may, in various embodiments, include energy modeling units 109A and109B, respectively. Energy modeling units 109A and 109B may each monitorenergy usage within their respective processor cores thereby allowing,in some embodiments, accounting of energy associated with a givenprocess being executed across multiple processor cores.

Memory block 102 may include any suitable type of memory such as aDynamic Random Access Memory (DRAM), a Static Random Access Memory(SRAM), a Read-only Memory (ROM), Electrically Erasable ProgrammableRead-only Memory (EEPROM), or a non-volatile memory, for example. It isnoted that in the embodiment of an integrated circuit illustrated inFIG. 1 , a single memory block is depicted. In other embodiments, anysuitable number of memory blocks may be employed.

Analog/mixed-signal block 103 may include a variety of circuitsincluding, for example, a crystal oscillator, a phase-locked loop (PLL),an analog-to-digital converter (ADC), and a digital-to-analog converter(DAC) (all not shown). In other embodiments, analog/mixed-signal block103 may be configured to perform power management tasks with theinclusion of on-chip power supplies and voltage regulators.Analog/mixed-signal block 103 may also include, in some embodiments,radio frequency (RF) circuits that may be configured for operation withwireless networks.

I/O block 104 may be configured to coordinate data transfer betweenintegrated circuit 100 and one or more peripheral devices. Suchperipheral devices may include, without limitation, storage devices(e.g., magnetic or optical media-based storage devices including harddrives, tape drives, CD drives, DVD drives, etc.), audio processingsubsystems, or any other suitable type of peripheral devices. In someembodiments, I/O block 104 may be configured to implement a version ofUniversal Serial Bus (USB) protocol or IEEE 1394 (Firewire®) protocol.

I/O block 104 may also be configured to coordinate data transfer betweenintegrated circuit 100 and one or more devices (e.g., other computersystems or integrated circuits) coupled to integrated circuit 100 via anetwork. In one embodiment, I/O block 104 may be configured to performthe data processing necessary to implement an Ethernet (IEEE 802.3)networking standard such as Gigabit Ethernet or 10-Gigabit Ethernet, forexample, although it is contemplated that any suitable networkingstandard may be implemented. In some embodiments, I/O block 104 may beconfigured to implement multiple discrete network interface ports.

In some embodiments, each of the aforementioned functional units mayinclude multiple circuits, each of which may include multiple devices,such as, e.g., metal-oxide semiconductor field-effect transistors(MOSFETs) connected via multiple wires fabricated on multiple conductivelayers. The conductive layers may be interspersed with insulatinglayers, such as, silicon dioxide, for example. Each circuit may alsocontain wiring, fabricated on the conductive layers, designated for apower supply net or a ground supply net.

Integrated circuit 100 may, in various embodiments, be fabricated on asilicon wafer (or simply “wafer”) along with numerous identical copiesof integrated circuit 100, each of which may be referred to as a “chip”or “die.” During manufacture, various manufacturing steps may beperformed on each chip in parallel. Once the manufacturing process hasbeen completed, the individual chips may be removed from the wafer bycutting or slicing through unused areas between each chip.

It is noted that the embodiment illustrated in FIG. 1 is merely anexample. In other embodiments, different functional units, and differentarrangements of functional units may be employed.

Turning now to FIG. 2 , an embodiment of a computing system thatincludes a voltage regulator is illustrated. In the illustratedembodiment, computing system 200 includes voltage regulator 202, whichis coupled to integrated 201 via regulated power supply 205. Each ofvoltage regulator 202 and integrated circuit 201 is coupled to groundsupply 203, and voltage regulator 202 is further coupled to power supply204. In various embodiments, integrated circuit 201 may correspond tointegrated circuit 100 as illustrated in FIG. 1 .

During operation, voltage regulator 202 may generate a voltage level onregulated supply 205. Depending on integrated circuit 201, the voltagelevel of regulated supply 205 may be higher or lower than the voltagelevel on power supply 204. The voltage level on regulated supply 205 mayvary within predetermined limits from a desired voltage level. Thevariation may result from changes in the voltage level on power supply204, variations in temperature, or changes in current demand fromintegrated circuit 201. Although only a single regulated power supply isdepicted in the embodiment illustrated in FIG. 2 , in other embodiments,voltage regulator 202 may be configured to generate multiple regulatedpower supplied.

Voltage regulator 202 may be designed in accordance with one of varyingdesign styles. In some embodiments, voltage regulator 202 may employ acombination of active and passive devices (not shown). Such passivedevices may, in some embodiments, include any suitable combination ofinductors and capacitors. In various embodiments, integrated circuit 201and voltage regulator may be fabricated using different semiconductormanufacturing processes, and may be mounted in a common integratedcircuit package or mounted on a common substrate.

It is noted that the embodiment illustrated in FIG. 2 is merely anexample. In other embodiments, different numbers of integrated circuits,and different numbers of voltage regulators providing different voltageslevels are possible and contemplated.

A block diagram of an embodiment of a voltage regulator unit isillustrated in FIG. 3 . In the illustrated embodiment, voltage regulator300 includes control circuit 301, passive components 307, comparisoncircuit 302, and reference generator circuit 303. In variousembodiments, voltage regulator 300 may correspond to voltage regulator200 as depicted in FIG. 2 . Each of control circuit 301, comparisoncircuit 302, reference generator circuit 303, and passive components 307may be mounted together on a single substrate. In some embodiments,control circuit 301, comparison circuit 302, and reference generatorcircuit 303 may be fabricated together on a common integrated circuit orother suitable substrate compatible with a semiconductor manufacturingprocess.

Control circuit 301 may be configured to receive power supply 304, andsource current to regulator power supply 305 through passive components307 dependent on control signal 308. In various embodiments, controlcircuit 301 may include multiple metal-oxide semiconductor field-effecttransistors (MOSFETs) or other suitable transconductance devices capableof selectively applying current to regulated power supply 305. Passivecomponents 307 may, in some embodiments, include one or more inductors,and one or more capacitors, or any other suitable passive component. Invarious embodiments, the components included in passive components 307may be fabricated together on a single silicon substrate, or they may bemanufactured on separate silicon substrates using differentsemiconductor manufacturing processes.

Comparison circuit 302 may, in various embodiments, be configured tocompare a voltage level on regulated power supply 305 and a voltagelevel on reference voltage 306. In response to the comparison,comparison circuit 302 may adjust a voltage level on control signal 308.In some embodiments, control signal 308 may switch between multiplediscrete voltage levels, each of which represents a logic level.Alternatively, control signal 308 may be an analog signal, which mayassume a continuous spectrum of voltage levels.

In various embodiments, reference generator circuit 303 may beconfigured to generate a voltage level on reference voltage 306dependent on the voltage level on power supply 304. The voltage level onreference voltage 306 may, in some embodiments, correspond to a desiredvoltage level for an integrated circuit, such as integrated circuit 100as illustrated in FIG. 1 , for example. In some embodiments, referencegenerator circuit 303 may include one or more sub-circuits (not shown),such as, band gap reference circuits, current mirrors, and the like.

The embodiment illustrated in FIG. 3 is merely an example. In otherembodiments, different functional units and different circuit topologiesmay be employed.

Turning to FIG. 4 , an embodiment of a voltage regulator module (VRM) isillustrated. In the illustrated embodiment, VRM 400 includes VRController 401, interconnect layer 402, inductor 404, and capacitor 405.In various embodiments, VR Controller 401 may correspond to portions ofvoltage regulator 300, namely control circuit 301, comparison circuit302, and reference generator 303.

Interconnect layer 402 is coupled to the top of VR Controller 401. Invarious embodiments, interconnect layer 402 may include multiple wiresfabricated on multiple conductive layers included within interconnectlayer 402. Such wires may provide routing paths from signal and powerterminals on VR Controller 401 to solder bumps 403 a-403 e, andterminals on inductor 404 and capacitor 403. In some embodiments,interconnect layer 402 may be fabricated onto VR Controller 401 using awafer scale packaging process or other suitable assembly process. Asused and described herein, a signal terminal may refer to a terminal onan integrated circuit, passive device, or interconnect layer or region,through which an electrical signal may be transmitted. Such anelectrical signal may include either analog or digital signals.Additionally, a power terminal, as used and described herein, may referto a terminal on an integrated circuit, passive device, or interconnectlayer or region dedicated to power supply or ground supply connections.

In various embodiments, inductor 404 and capacitor 405 may be fabricatedon a silicon or other suitable substrate using a semiconductormanufacturing process. Alternatively, or additionally, inductor 404 andcapacitor 405 may be discrete components manufactured using any suitablemanufacturing process.

It is noted that the embodiment illustrated in FIG. 4 is merely anexample. In other embodiments, different number of inductors andcapacitors, and different arrangements of the inductors and capacitorsare possible and contemplated.

A different embodiment of a VRM is depicted in FIG. 5 . In theillustrated embodiment, VRM 500 includes VR Controller 501, interconnectlayer 502, and passive device die 503. In various embodiments, VRController 501 and interconnect layer 502 may correspond to VRController 401 and interconnect layer 402, respectively, as depicted inthe embodiment illustrated in FIG. 4 .

Passive device die 503 may, in various embodiments, include one or moreinductors and capacitors, and may be manufactured using a semiconductormanufacturing process. During manufacture, connection paths 506 a and506 b (also referred to herein as “vias” or “through silicon vias”) arecreated in passive device die 503 to allow connections from solder bumps504 a-504 d to terminals on interconnect layer 502, which, in turn, arecoupled to terminals on VR controller 501. The passive devices includedin passive device die 503 may be coupled to circuitry included in VRController 501 through connectors 505. In various embodiments,connectors 505 may be solder bumps or any other medium suitable forcoupling passive device die 503 to VR controller 501.

The embodiment illustrated in FIG. 5 is a particular example of a VRM.In other embodiments, different numbers vias and connectors may beemployed.

Turning to FIG. 6 , another embodiment of a VRM is illustrated. In theillustrated embodiment, VRM 600 includes VR Controller 601, inductor die603, and capacitor die 604. In various embodiments, VR Controller 601and may correspond to VR Controller 401 as depicted in the embodimentillustrated in FIG. 4 .

Capacitor die 604 may include one or more capacitors, and inductor die603 may include one or more inductors. Capacitor die 604 and inductordie 603 may be manufactured using respective semiconductor manufacturingprocesses. Each of capacitor die 640 and inductor die 603 includerouting paths through the die that form vias 606 a and 606 b, therebyallowing connects from solder bumps 605 a-605 d to terminals oninterconnect layer 602. In various embodiments, interconnect layer 602may include multiple wires fabricated on multiple conductor layersforming connections between terminals on VR Controller 601 and terminalson interconnect layer 602.

Terminals on capacitor die 604 are coupled to a first set of terminalson inductor die 603 via connectors 607. Additionally, a second set ofterminals on inductor die 603 are coupled to terminals on interconnectlayer 602 via connectors 608. In various embodiments, connectors 607 and608 may include solder bumps or any other suitable medium. In someembodiments, space between capacitor die 604 and inductor die 603 may befilled with an electrically insulating material (not shown), such as,silicon dioxide, for example. In a similar fashion, space betweeninductor die 603 and interconnect layer 602 may also be filled with theinsulating material.

It is noted that the embodiment depicted in FIG. 6 is merely an example.In other embodiments, different arrangements of the inductor andcapacitor dies may be employed.

A different embodiment of a VRM is illustrated in FIG. 7 . In theillustrated embodiment, VRM 700 includes voltage regulator 701, inductor702, and capacitor 703. In various embodiments, voltage regulator 701may correspond to VR Controller 401 as illustrated in the embodiment ofFIG. 4 . In some embodiments, each of voltage regulator 701, inductor702, and capacitor 703 may be chips or dies manufactured usingrespective semiconductor manufacturing processes.

Voltage regulator 701, inductor 702, and capacitor 703 may be arrangedin a planar fashion. Interconnect 704 may be fabricated or assembled ontop of the arrangement of voltage regulator 701, inductor 702, andcapacitor 703. In various embodiments, interconnect 704 may includemultiple wires (not shown), fabricated on multiple metal layersseparated by multiple insulating layers, that connect terminals ofvoltage regulator 701 to terminals on inductor 702 and capacitor 703.Additionally, some of the multiple wires included in interconnect 704may couple terminals of voltage regulator to solder bumps 705 a-705 d.

The embodiment illustrated in FIG. 7 is merely an example. In otherembodiments, different arrangements of voltage regulator 701, inductor702, and capacitor 703 are possible and contemplated.

To reduce parasitic circuit effects in connections between voltageregulators and SoCs, VRMs and SoCs may be mounted in a common package,commonly referred to as a “system package.” An embodiment of a systempackage is illustrated in FIG. 8 . In the illustrated embodiments,system package 800 includes interconnect 804, SoC 802, and VRM 803. Invarious embodiments, VRM 803 may correspond to any of the embodimentsillustrated in FIG. 4 through FIG. 7 , and SoC 802 may correspondintegrated circuit 100 as illustrated in FIG. 1 .

Each of SoC 802 and VRM 803 are coupled to interconnect 804. In variousembodiments, interconnect 804 includes multiple wires fabricated onmultiple wiring layers. Some of the multiple wires of interconnect 804may couple terminals on SoC 802 to terminals on VRM 803, therebyallowing a regulated power supply from VRM 803 to be coupled to SoC 802.Additionally, some of the multiple wires included in interconnect 804may couple terminals on SoC 802 and VRM 803 to solder bumps 805 a-805 e.

On a side of the package body 808 opposite from solder bumps 805 a-805e, solder bumps 806 a-b couple DRAM 809 to package body 808. In variousembodiments, package body 808 includes vias 807 a-b that couple solderbumps 806 a-b to terminals on interconnect 804. Wires included ininterconnect 804 may then connect the aforementioned terminals ofinterconnect 804 to terminals of SoC 802. Although a DRAM is included insystem package 800, in other embodiments, any suitable memory may beemployed.

It is noted that the embodiment illustrated in FIG. 8 is merely anexample. In other embodiments, chips or dies other than SoC 802 and VRM803 may be included in system package 800.

Turning to FIG. 9 , another embodiment of a system package isillustrated. In the illustrated embodiment, system package 900 includesinterconnect 904, VRM 903, and SoC 902. In various embodiments, VRM 903may correspond to any of the embodiments illustrated in FIG. 4 throughFIG. 7 , and SoC 902 may correspond integrated circuit 100 asillustrated in FIG. 1 .

Interconnect 904 includes multiple wires fabricated on multiple wiringlayers. Some of the multiple wires of interconnect 904 may coupleterminals on SoC 902 and VRM 903, to solder bumps 905 a-905 e. Incontrast to the embodiment depicted in FIG. 8 , some power terminals ofSoC 902 are coupled directly to output terminals of VRM 903, allowingVRM 903 to provide a regulated power supply to SoC 902.

In a similar fashion to the embodiment of FIG. 8 , DRAM 909 is mountedto package body 908 allowing connections to terminals on interconnect904. Wires included in interconnect 904 may couple vias 907 a-b toterminals of SoC 902. As noted above, in regard to FIG. 8 , DRAM 909may, in other embodiments, include as any suitable type of memory.

It is noted that the embodiment illustrated in FIG. 9 is merely anexample. In other embodiments, different arrangements of VRM 903 and SoC902 may be employed.

A different embodiment of a system package is illustrated in FIG. 10 .In the illustrated embodiment, system package 1000 includes interconnect1004, SoC 1002, and VRM 1003. In various embodiments, VRM 1003 maycorrespond to any of the embodiments depicted in FIG. 4 through FIG. 7 ,and SoC 1002 may correspond to integrated circuit 100 as illustrated inthe embodiment of FIG. 1 .

Terminals of SoC 1002 are coupled to terminals of interconnect 1004,which are, in turn, coupled to wires included interconnect 1004. Invarious embodiments, the wires included in interconnect 1004 may befabricated on multiple metal layers separated by insulating layers. Someof the wires included in interconnect 1004 may be coupled to solderbumps 1005 a-e, thereby allowing connections from SoC 1002 to solderbumps 1005 a-e.

In contrast to the embodiment depicted in FIG. 9 , VRM 1003 is mountedon a side of interconnect 1004 opposite the side on which SoC 1002 ismounted. Some of the wires included in interconnect 1004 may coupleoutput terminals of VRM 1003 to power terminals of SoC 1002, therebyallowing VRM 1003 to source a regulated power supply to SoC 1002. Otherwires included in interconnect 1004 may connect power terminals of VRM1003 to one or more of solder bumps 1005 a-e, providing power and groundpaths to VRM 1003.

DRAM 1009 is coupled to package body 1008 using solder bumps 1006 a-b.Vias 1007 a-b couple solder bumps 1006 a-b to terminals on interconnect1004. Wires included in interconnect 1004 may couple the aforementionedterminals on interconnect 1004 to terminals on SoC 1002. In someembodiments, the terminals on interconnect 1004 coupled to vias 1007 a-bmay be coupled one or more of solder bumps 1005 a-b.

It is noted that the relative placement between SoC 1002 and VRM 1003 asdepicted in the embodiment of FIG. 10 is merely an example.

Turning to FIG. 11 , a different embodiment of a system package isillustrated. In the illustrated embodiment, system package 1100 includesSoC 1102, VR 1103 c, inductor die 103 a, and capacitor die 1103 b. Invarious embodiments, voltage regulator (also referred to herein as “VR”)1103 c may correspond to portions of voltage regulator 300, namelycontrol circuit 301, comparison circuit 302, and reference generator 303as illustrated in FIG. 3 , and SoC 1102 may correspond to integratedcircuit 100 as illustrated in FIG. 1 .

Capacitor die 1103 b, inductor die 1103 a, and SoC 1102 are arranged ina stack and mounted on interconnect 1104. In various embodiments,inductor die 1103 a and capacitor die 1103 b may include vias that allowterminals on SoC 1102 to be coupled to terminals of interconnect 1104through inductor die 1103 a and capacitor die 1103 b. It is noted that,in various embodiments, inductor die 1103 a may include multipleinductors fabricated using a semiconductor manufacturing process, andcapacitor die 1103 b may include multiple capacitors fabricated using asimilar semiconductor manufacturing process.

Package body 1110 includes vias 1107 a-b, which couple solder bumps 1106a-b to terminals on interconnect 1104. Wires included in interconnect1104 may be used to connect terminals on interconnect 1104, which arecoupled to vias 1107 a-b, to vias through inductor die 1103 a andcapacitor die 1103 b, thereby allowing a signal path from DRAM 1109 toSoC 1102. Other wires included in interconnect 1104 may provide a pathfrom terminals on SoC 1102, through inductor die 1103 a and capacitordie 1103 b, to solder bumps 1105 a-e. It is noted that although a singleDRAM is depicted in the embodiment of FIG. 11 , in other embodiments,any suitable number and type of memory devices, may be employed.

VR 1103 c may be mounted on a side of interconnect 1104 opposite of aside where SoC 1102, inductor die 1103 a, and capacitor die 1103 b aremounted. Wires included in interconnect 1104 may couple input/outputterminals of VR 1103 c to capacitor die 1103 b. Vias included ininductor die 1103 a and capacitor die 1103 b may provide a wiring pathfrom VR 1103 c to SoC 1102, allowing VR 1103 c to source a regulatedpower supply voltage to SoC 1102.

Although a particular arrangement of SoC 1102, inductor die 1103 a, andcapacitor die 1103 c is depicted in the embodiment of FIG. 11 , it isnoted that the present embodiment is merely an example. In otherembodiments, different arrangements of SoC 1102, inductor die 1103 a,and capacitor die 1103 c are possible and contemplated.

A different embodiment of a system package is illustrated in FIG. 12Aand FIG. 12B. In the illustrated embodiment, system package 1200includes SoC 1202, capacitor die 1203 b, VR 1203 a, and inductor 1203 c.In various embodiments, VR 1203 a may correspond to portions of voltageregulator 300, namely control circuit 301, comparison circuit 302, andreference generator 303 as illustrated in FIG. 3 , and SoC 1202 maycorrespond to integrated circuit 100 as illustrated in FIG. 1 .

SoC 1202 and capacitor die 1203 b are arranged in a stacked fashion inpackage body 1208. In some embodiments, capacitor die 1203 b includesvias (not shown) that allow terminals of SoC 1202 to be coupled tointerconnect 1203 b. In various embodiments, interconnect 1203 bincludes multiple wires fabricated on multiple metal layers separated byinsulating layers. Such wires may be used to connect solder bumps 1205a-e to terminals on capacitor die 1203 b.

In a similar fashion, interconnect 1204 a includes multiple wires thatmay be used to connect terminals of DRAM 1209 a-b, inductor 1203 c, andVR 1203 a to vias 1207 a-b included in package body 1208. Although onlytwo vias are shown, in various embodiments, any suitable number of viasmay be employed.

As depicted in FIG. 12 , DRAM 1209 a-b, inductor 1203 c, and VR 1203 aare mounted on the top of system package 1200. As described above, usingwires in interconnect 1204 a-b, and vias 1207 a-b, signals and powersupplies for DRAM 1209 a-b, inductor 1203 c, and VR 1203 a may be routedto solder bumps 1205 a-e or the stack of SoC 1202 and capacitor die 1203b.

It is noted that the embodiment illustrated in FIG. 12A-B is merely anexample. In other embodiments, different arrangements of inductor 1203 cmay be employed.

Turning to FIG. 13 , another embodiment of a system package isillustrated. In the illustrated embodiment, system package 1300 includesSoC 1302, VR 1303 a, inductor 1303 b, and capacitor 1303 c. In variousembodiments, VR 1303 a may correspond to portions of voltage regulator300, namely control circuit 301, comparison circuit 302, and referencegenerator 303 as illustrated in FIG. 3 , and SoC 1302 may correspond tointegrated circuit 100 as illustrated in FIG. 1 .

Within package body 1308, VR 1303 a, inductor 1303 b, and capacitor 1303c are arranged in a first layer, and SoC 1302 is arranged in a secondlayer. Wire and vias included within package body 1308 are employed tocouple terminals of VR 1303 a, inductor 1303 b, and capacitor 1303 c toterminals included in SoC 1302. Additionally, other wires and viasincluded in package body 1308 may be used to couple terminals of SoC1302, VR 1303 a, inductor 1303 b, and capacitor 1303 c to interconnect1304.

Interconnect 1304 may, in various embodiments, include multiple wiresfabricated on multiple metal layers separated by a insulating layers. Insome embodiments, wires included in interconnect 1304 may provideconnections between solder bumps 1305 a-e to terminals on interconnect1304 which are coupled to SoC 1302, VR 1303 a, inductor 1303 b, andcapacitor 1303 c using wires and vias included in package body 1308.Additionally, other wires included in interconnect 1304 may be employedto connect vias 1307 a-b of package body 1308 to terminals of any of SoC1302, VR 1303, inductor 1303 b, and capacitor 1303 c, to provide awiring path between DRAM 1309 and the aforementioned subcomponents.

DRAM 1309 is coupled to solder bumps 1306 a-b, which, in turn, arecoupled to vias 1307 a-b included in package body 1308. Although asingle DRAM is depicted in the embodiment of FIG. 13 , in otherembodiments, any suitable number of DRAMs or other memory devices may beemployed.

It is noted that the embodiment illustrated in FIG. 13 is one example ofa system package. In other embodiments, different subcomponents anddifferent arrangements of subcomponents are possible and contemplated.

Another embodiment of a system package is illustrated in FIG. 14 . Inthe illustrated embodiment, system package 1400 includes SoC 1402, VR1403 a, inductor 1403 b, and capacitor 1403 c. In various embodiments,VR 1403 a may correspond to portions of voltage regulator 300, namelycontrol circuit 301, comparison circuit 302, and reference generator 303as illustrated in FIG. 3 , and SoC 1402 may correspond to integratedcircuit 100 as illustrated in FIG. 1 .

VR 1403 a, inductor 1403 b, and capacitor 1403 c are mounted onsubstrate core 1407, which is, in turn, mounted on interconnect 1408. Invarious embodiments, interconnect 1408 may include multiple wiresfabricated on multiple metal layers separated by insulating layers. Someof the multiple wires included in interconnect 1408 may couple terminalsof VR 1403 a to one or more of solder bumps 1405 a-e. Additionally,other wires included in interconnect 1408 may couple terminals of VR1403 a to terminals of inductor 1403 b and capacitor 1403.

Interconnect 1403 may also include multiple wires fabricated on multiplemetal layers separated by insulating layers. In various embodiments,some of the wires included in interconnect 1403 may couple terminals ofSoC 1402 to terminals of VR 1403 a, thereby allowing VR 1403 a to sourcea regulated power supply to SoC 1402. Other wires included ininterconnect 1403 may couple terminals of SoC 1402 to one or more ofsolder bumps 1405 a-e, using vias included in substrate core 1407 (notshown).

In various embodiments, interconnect 1403 may be fabricated on top ofsubstrate core 1407 once VR 1403 a, inductor 1403 b, and capacitor 1403c have been mounted. The fabrication process may, in some embodiments,include the deposition and etching of metal layers, deposition ofinsulating layers, and the like. In other embodiments, interconnect 1403may be fabricated separately from substrate core 1407, and then attachedto substrate core 1407 using any suitable attachment method.

It is noted that the embodiment illustrated in FIG. 14 is merely anexample. In other embodiments, different arrangement of the components,such as, e.g., VR 1403 a, may be employed.

Turning to FIG. 15 , a flow diagram of an embodiment of a method forassembling a system package is illustrated. The method begins in block1501. Wafers including multiple SoC dies, voltage regulator dies, andpassive device dies may then be received (block 1502). In someembodiments, wafers for each type of die, such as, e.g., voltageregulator dies, may be fabricated using a dedicated semiconductormanufacturing process. Prior to further assembly steps, each of thewafers may be tested, and failing dies included within a given wafer maybe marked so that such failing dies are not assembled into a package.

A voltage regulator die and one or more passive device dies may then beassembled into a VRM (block 1503). In various embodiments, the voltageregulator die and the one or more passive device dies may be assembledinto a VRM corresponding to one of the embodiments illustrated in FIG. 4through FIG. 7 . Once the VRM is assembled, the VRM may then be mountedin a system package along with one of the SoC dies (block 1504). Thesystem package may, in various embodiments, correspond to one of theparticular embodiments of a system package illustrated in FIG. 8 throughFIG. 14 .

Assembly of the system package may then be completed (block 1505). Insome embodiments, the final assembly may include mounting one or morememory devices into the system package. The one or more memory devicesmay be arranged, in various embodiments, as depicted in the embodimentsillustrated in FIG. 8 through FIG. 10 . In some embodiments, once thesystem package is assembled, a final test operation may be performed.The method may then conclude in block 1506.

Although some of the operations included in the flow diagram of FIG. 15are depicted as being performed in parallel, in other embodiments, oneor more of the operations may be performed in parallel.

Turning to FIG. 16 , a flow diagram depicting another embodiment of amethod of assembling a system package is illustrated. The method beginsin block 1501. Wafers including multiple SoC dies, voltage regulatordies, and passive device dies may then be received (block 1502). In someembodiments, wafers for each type of die, such as, e.g., voltageregulator dies, may be fabricated using a dedicated semiconductormanufacturing process. Prior to further assembly steps, each of thewafers may be tested, and failing dies included within a given wafer maybe marked so that such failing dies are not assembled into a package.

One each of a voltage regulator die, an inductor die, a capacitor die,and an SoC die may then be mounted in the system package (block 1603).The system package may, in various embodiments, correspond to one of theparticular embodiments of a system package illustrated in FIG. 8 throughFIG. 14 .

Assembly of the system package may then be completed (block 1604). Insome embodiments, the final assembly may include mounting one or morememory devices into the system package. The one or more memory devicesmay be arranged, in various embodiments, as depicted in the embodimentsillustrated in FIG. 8 through FIG. 10 . In some embodiments, once thesystem package is assembled, a final test operation may be performed.The method may then conclude in block 1605.

It is noted that the embodiment of the method depicted in the flowdiagram of FIG. 16 is merely an example. In other embodiments, differentoperations and different orders of operations may be employed.

Although specific embodiments have been described above, theseembodiments are not intended to limit the scope of the presentdisclosure, even where only a single embodiment is described withrespect to a particular feature. Examples of features provided in thedisclosure are intended to be illustrative rather than restrictiveunless stated otherwise. The above description is intended to cover suchalternatives, modifications, and equivalents as would be apparent to aperson skilled in the art having the benefit of this disclosure.

The scope of the present disclosure includes any feature or combinationof features disclosed herein (either explicitly or implicitly), or anygeneralization thereof, whether or not it mitigates any or all of theproblems addressed herein. Accordingly, new claims may be formulatedduring prosecution of this application (or an application claimingpriority thereto) to any such combination of features. In particular,with reference to the appended claims, features from dependent claimsmay be combined with those of the independent claims and features fromrespective independent claims may be combined in any appropriate mannerand not merely in the specific combinations enumerated in the appendedclaims.

1-20. (canceled)
 21. An apparatus comprising: a passive deviceintegrated circuit (IC) die having one or more passive circuit devicesimplemented thereon; a plurality of solder balls coupled to the passivedevice IC die; a voltage regulator controller circuit comprising one ormore circuit elements of a voltage regulator circuit; and aninterconnect layer arranged between the passive device IC and thevoltage regulator controller, wherein the interconnect layer iselectrically coupled to the voltage regulator controller and furthercoupled to the passive IC die by a first plurality of electricalconnectors, and further coupled to the plurality of solder balls bycorresponding ones of a second plurality of electrical connectors,wherein the second plurality of electrical connector comprise aplurality of connecting vias passing through the passive IC die.
 22. Theapparatus of claim 21, wherein the passive IC die includes one or moreinductors implemented thereon.
 23. The apparatus of claim 21, whereinthe passive IC die includes one or more capacitors implemented thereon.24. The apparatus of claim 21, wherein the voltage regulator controllerand the one or more passive circuit devices form a voltage regulatorcircuit that is configured to generate a regulated supply voltage on aregulated supply voltage node, and wherein the voltage regulatorcontroller includes: a reference generator circuit configured togenerate a reference voltage; a comparison circuit configured to comparethe reference voltage to the regulated supply voltage; and a controlcircuit configured to control operation of the voltage regulator circuitbased on comparing the reference voltage and the regulated supplyvoltage.
 25. The apparatus of claim 24, wherein the control circuitincludes one or more devices configured to source current, through theone or more passive circuit devices, to the regulated supply voltagenode.
 26. The apparatus of claim 24, further comprising an integratedcircuit coupled to the voltage regulator circuit, wherein the integratedcircuit includes one or more functional circuit blocks coupled toreceive the regulated supply voltage.
 27. The apparatus of claim 26,wherein the one or more functional circuit blocks includes at least oneof a general purpose processor circuit and a memory.
 28. The apparatusof claim 21, wherein the first plurality of electrical connectorscomprises one or more solder bumps.
 29. A method comprising:manufacturing a voltage regulator assembly, wherein manufacturing thevoltage regulator assembly comprises: receiving a passive deviceintegrated circuit (IC) die having one or more passive circuit elementsimplemented thereon; coupling a plurality of solder balls coupled to thepassive device IC die; receiving a voltage regulator controller circuitcomprising one or more circuit elements of a voltage regulator circuit;arranging an interconnect layer between the passive device IC and thevoltage regulator controller; electrically coupling the interconnectlayer to the passive IC die by a first plurality of electricalconnectors; electrically coupling the voltage regulator controllercircuit to the one or more passive circuit elements using theinterconnect layer; electrically coupling the interconnect layer to onesof the plurality of solder balls using corresponding ones of a secondplurality of electrical connectors, the second plurality of electricalconnectors comprising a plurality of connecting vias passing through thepassive IC die.
 30. The method of claim 29, further comprisingassembling a system package, wherein assembling the system packagecomprises: receiving an integrated circuit having one or more functionalcircuit blocks implemented thereon; and coupling the voltage regulatorassembly to the integrated circuit.
 31. The method of claim 30, furthercomprising performing a final test procedure on the system package. 32.The method of claim 29, wherein the passive IC die includes one or moreinductors implemented thereon.
 33. The method of claim 29, wherein thepassive IC die includes one or more capacitors implemented thereon. 34.The method of claim 29, wherein electrically coupling the interconnectlayer to the passive IC die by a first plurality of electricalconnectors comprises connecting the interconnect layer to the passive ICdie using a plurality of solder bumps.
 35. An apparatus comprising: anintegrated circuit having a plurality of functional circuit blocksimplemented thereon; a voltage regulator assembly coupled to theintegrated circuit, the voltage regulator assembly including: a passivedevice integrated circuit (IC) die coupled to the integrated circuit,the passive device IC die having one or more passive circuit componentsimplemented thereon and further including a plurality of solder balls; avoltage regulator controller circuit having one or more components of avoltage regulator circuit; and an interconnect layer disposed betweenthe passive device IC die and the voltage regulator controller circuit,wherein the voltage regulator circuit is electrically coupled to thepassive IC die by the interconnect layer, and wherein the passive IC dieis further coupled to the integrated circuit through a plurality ofelectrical connectors extending through the passive device IC die fromthe interconnect layer to one or more corresponding ones of theplurality of solder balls.
 36. The apparatus of claim 35, wherein thepassive IC die includes one or more inductors implemented thereon. 37.The apparatus of claim 35, wherein the passive IC dies includes one ormore capacitors implemented thereon.
 38. The apparatus of claim 35,wherein the voltage regulator controller and the one or more passivecomponents form a voltage regulator circuit that is configured togenerate a regulated supply voltage on a regulated supply voltage node,and wherein the voltage regulator controller includes: a referencegenerator circuit configured to generate a reference voltage; acomparison circuit configured to compare the reference voltage to theregulated supply voltage; and a control circuit configured to controloperation of the voltage regulator circuit based on comparing thereference voltage and the regulated supply voltage.
 39. The apparatus ofclaim 38, wherein at least one of the plurality of functional circuitblocks is configured to operate using the regulated supply voltage. 40.The apparatus of claim 35, wherein the plurality of functional circuitblocks includes at least one of a general purpose processor circuit anda memory.